Butyl glycol acetate

　　1. Coatings and Inks Industry (accounting for approximately 40%)

　　High-temperature curing coatings: Used as a main solvent in automotive OEM paints and coil coatings to delay the evaporation rate and avoid defects such as "orange peel" and "pinholes" in the coating film during high-temperature curing. For example, in 180℃ baking coatings, its boiling point (246℃) ensures that the solvent completely evaporates after film formation without residue.

　　Plastic coatings: Exhibits excellent wettability to plastic substrates such as ABS and PC, enhancing coating adhesion, and is commonly used in matte paints and wear-resistant coatings for electronic product housings (such as mobile phones and laptops).

　　Printing inks: Regulates drying speed in gravure printing inks to ensure pattern precision during multi-color overprinting; dissolves silver paste resin in conductive inks to ensure stable conductive performance.

　　2. Electronics and Precision Manufacturing Fields

　　Electronic component cleaning: Due to its high boiling point and low toxicity (rat oral LD₅₀ is 6500 mg/kg), it can replace high-risk solvents such as trichloroethylene for cleaning flux residues or oil stains on circuit board surfaces, avoiding the environmental risks associated with traditional solvents.

　　Electronic coatings and encapsulation adhesives: Used as a solvent for copper clad laminate coatings and LED encapsulation adhesives; its slow evaporation characteristic ensures uniform film formation during heat curing, reducing bubble generation and meeting the process requirements of precision devices.

　　3. Adhesives and Composite Materials

　　High-performance adhesives: Used as a diluent in epoxy and polyurethane adhesives to reduce viscosity, while extending the working time (pot life) through its slow evaporation characteristic, making it particularly suitable for large-area gluing or lamination processes. For example, in adhesives for wind turbine blades, DBA can regulate the curing rate and enhance the structural strength of the blades.

　　Composite material processing: Used in resin systems for carbon fiber prepregs to dissolve epoxy resin and regulate wettability, ensuring full combination of fiber and resin, thereby improving the mechanical properties of composite materials.

　　4. Special Industrial Applications

　　Metalworking fluids: Used as a coupling agent or lubricant carrier to improve the adhesion of cutting fluids to metal surfaces, while also possessing certain rust prevention functions.

　　Paint stripper formulations: Compounded with ketone solvents to remove old coating films or layers, especially suitable for difficult-to-dissolve epoxy and polyurethane coatings.

CAS NO: 124-17-4

EC NO: 204-685-9

Molecular Formula: C₁₀H₂₂O₅

Molecular Weight: 222.2787

Aliases: Butyl diglycol acetate; Butyl carbitol acetate; 2-(2-n-Butoxyethoxy) ethyl acetate; Butyl carbitol acetate; Diethylene glycol butyl ether acetate;

Structural Formula: